Everything about Noohapou
Everything about Noohapou
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The POU3500 technique delivers dynamic temperature control of the procedure chamber cathode / electrode / anode and may be synchronized with any etch approach.
Resource & TCU program calibration techniques range external examination tools not used frequently for verifying
the data click here underneath is categorized by semiconductor process and tool company. Each and every table consists of an Applications Matrix that exhibits qulified and industrial procedures.
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This exceptional procedure, presenting a little form factor, inexpensive-of-possession and Dynamic Temperature Management offered procedure and machines engineers a different Software to optimize their temperature sensitive processes.
The accuracy of your POU 3300 allows for independent control of the process fluid temperature to your wafer chuck within +/- 0.1 °C of set position, as well as the fast reaction time with the procedure permits for max wafer-to-wafer repeatability throughout the etch procedure.
All static TCUs involve extra cooling & heating capacities due to their very significant approach fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Management process is under one gallon.
With all the POU3300, you'll be able to realize unprecedented ends in etch performance, chamber uptime, decreased price of ownership and fab House utilization – all whilst increasing your system dependability.
big Footprint: Static models occupy major House in the fabrication Resource region, minimizing its performance.
LAUDA-Noah is Assembly these new worries and it has incorporated Electrical power preserving technological innovation in methods that happen to be pleasant to your atmosphere and also have a low priced to function.
The data set here is from the 200mm volume production wafer fab and Plainly illustrates the benefit of the LAUDA-Noah POU process.
The POU3300 system offers dynamic temperature Charge of the procedure chamber cathode / electrode / anode and will be synchronized with any etch method.
the truth is the fact legitimate Dynamic Temperature Management can only be attained when all five (five) of the following system structure and set up necessities are fulfilled:
(consequently, setting up a static device beside chamber will likely not permit it to supply dynamic temperature Manage)
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